Lead-Free & Green Product FAQs
Compliance, Definitions and Marking
What does “RoHS” mean?
Answer: RoHS is an acronym for Restriction of the use of certain Hazardous Substances in Electrical and Electronic Equipment (EEE), a European Union Directive (EU RoHS Directive 2002/95/EC) which became enforceable on 01 July 2006. This EU Directive set maximum concentration limits on lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE) used in EEE.
Are LSI products “RoHS-5/6” or “RoHS-6/6”?
Answer: All LSI IC products are “RoHS-5/6” Compliant and do not contain cadmium, hexavalent chromium, mercury, polybrominated biphenyls (PBB), or polybrominated diphenyl ethers (PBDE) above EU RoHS Directive limits. Only lead-free IC products are considered “RoHS-6/6” Compliant.
What is LSI’s definition of “lead-free”?
Answer: Similar to the EU RoHS Directive, LSI defines the term "lead-free" to mean that lead is “not intentionally added” or “is present” at a maximum 0.1% (1,000 ppm) as an incidental impurity in homogeneous materials.
Are LSI lead-free products RoHS Compliant?
Answer: Yes. All versions of LSI lead-free IC products are RoHS compliant. In the case of leadframes and ball grid arrays (BGAs), these lead-free products are manufactured without lead in the interconnects unless authorized by an exemption in the Annex to the EU RoHS Directive. Additionally, all LSI IC products (both lead-containing and lead-free) do not contain cadmium, hexavalent chromium, mercury, polybrominated biphenyls (PBB), or polybrominated diphenyl ethers (PBDE). LSI's Flip-Chip BGA packages currently qualify for an exemption from under the EU RoHS Directive. Under this exemption, first level interconnect solder bumps between the semiconductor die and carrier within flip-chip package types can continue to contain lead and still be considered RoHS compliant. The second level solder bumps on the exterior of the package are lead-free. LSI does offer a completely lead-free Flip-Chip package option. LSI also offers storage PCBA products which are RoHS compliant. Some storage PCBA products are also halogen-free in addition to being RoHS Compliant.
What is LSI’s definition of “Green”?
Answer: The definition of "Green" is not currently defined by any international regulation or industry standard organizations; therefore "green" is generally company or user defined. LSI defines "Green” IC Products as those that are RoHS Compliant/Lead-free, Halogen-free and Antimony-free. More specifically, LSI’s “Green” IC Products are:
- RoHS Compliant/Lead-free – i.e., Quantity limit of 0.1 % by mass (1000 PPM) in homogeneous material for: lead, mercury, hexavalent chromium, polybrominated biphenyls (PBB), polybrominated diphenyl ethers (PBDE) and quantity limit of 0.01 % by mass (100 PPM) of homogeneous material for Cadmium
- Halogen-free – i.e., Quantity limit of 0.09 % by mass (900 PPM) in homogeneous material for Bromine and Chlorine and less than 0.15% (1500 PPM) total Bromine and Chlorine in homogeneous materials
- Antimony-free – i.e., Quantity limit of 0.09 % by mass (900 PPM) in homogeneous material for Antimony.
What's the difference between "Green" and "RoHS Compliant" products?
Answer: LSI’s “Green” IC Products are Halogen-free and Antimony-free in addition to being RoHS Compliant and Lead-free. LSI continues to closely monitor governmental bodies and industry standardization groups on “green” definitions to ensure product compliance.
What is LSI’s lead-free marking standard for components and shipping containers?
Answer: LSI has adopted the IPC/JEDEC Marking and Labeling of Components (J-STD-609A) for marking its packages as follows:
|e0 = Lead |
e1 = SnAgCu (i.e. solder balls)
e2 = Tin alloys (i.e. SnCu, SnAg) with
no bismuth (Bi) nor zinc (ZN)
e3 = Sn (i.e. matte Sn)
e4 = Pre-plated (i.e. NiPdAu, NiPd)
e6 = Contains bismuth (Bi)
How do you distinguish between LSI's lead-free products and tin/lead products?
Answer: Customers can distinguish between a lead-free IC product and a tin/lead product by either the part number designation (e.g., an “L-“ prefix added to the existing tin/lead product code) or the lead free markings on the package themselves. In general, all lead-free products are assigned a new part number. Effective November 2007, LSI began using a new package naming convention to help our customers identify lead free product. Package name suffixes may contain the following letters to designate lead free products:
1. Lead Frame: L = lead free; G = “Green” and lead free.
2. BGA: L = Lead free; G = “Green” and lead free; K = lead free, halogen free, but not antimony free.
3. Flip Chip: G = “Green” and lead free balls and bumps; LM = lead free balls and bumps; K or L = lead free balls only.
IC product labels contain an Environmental Compliance Status. There are four distinct Environmental Compliance Statuses for the EU RoHS Directive and they are:
1. RoHS Compliant and Pb-Free - All six (6) EU RoHS Directive restricted substances absent or below threshold limits.
2. RoHS Compliant and Green- All six (6) EU RoHS Directive restricted substances absent or below threshold limits and meets all the requirements for LSI Green IC Product.
3. RoHS Compliant exc. Pb in 2LI – Product contains lead (Pb) in 2nd level interconnect, solder ball or plated leads per an EU RoHS Directive Exemption.
4. RoHS Compliant w/FC exemption - Product contains lead (Pb) in solder between die (bumped) and substrate - internal to Flip Chip package interconnect per the EU RoHS Directive Exemption; however the external (2nd level interconnect) solder balls are lead-free.
Can I get a Material Declaration, IPC-1752 report or additional product environmental information?
Answer: Yes. Please contact
your local LSI Sales Representative for a Material Declaration, IPC-1752 report or other product environmental information such as analytical reports.
Will LSI continue to offer tin-lead solutions?
Answer: Yes. LSI understands that customers will have an ongoing need for tin/lead solutions and is committed to supporting customer tin/lead product needs throughout their transition to lead-free products. LSI recognizes the industry-wide issues of migrating to lead-free products, including compatibility of the tin/silver/copper (SAC) alloy with tin/lead paste, RoHS exemptions, and spare parts. LSI will work with customers having specific requirements for lead-containing products.
Do lead-free IC packages meet 260oC temperature rating?
Answer: LSI packages meet J-STD-020C or J-STD-20D requirements according to package size, volume and date of qualification. (In the March 2008 timeframe, LSI implemented reflow profiles following JEDEC J-STD-020D for new package and product qualifications.) J-STD-020C and J-STD-020D are joint standards established between IPC
(Association Connecting Electronics Industries) and JEDEC
which identifies the classification level of non-hermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress. Customer specific requirements will be reviewed on case by case basis.
Are LSI lead-free IC packages compliant to the JEDEC industry standard?
Answer: Yes. All LSI lead-free IC packages are compliant with J-STD-020C or J-STD-20D requirements for moisture sensitivity / reflow classification.
Can standard tin-lead components be assembled under lead-free reflow conditions?
Answer: LSI recommends reflowing components with the appropriate reflow temperature guidelines defined by J-STD-020C or J-STD-02D. It is not recommended to mix lead-free packages with standard tin-lead assembly conditions (backward compatibility) or vice versa.