​Substances of Concern

 

LSI recognizes that certain substances such as heavy metals and brominated and chlorinated compounds are known to be toxic or potentially harmful to the environment. These substances are undesirable in products and packing materials or when used in the manufacture of our products. Such concerns have lead to a myriad of legal, industry and customer requirements. To ensure our products do not contain substances of concern, LSI has developed a comprehensive Worldwide Standard on Environmentally Restricted Substances, Reportable Substances and Other Materials of Concern (WWS-07 ). This Standard adopts relevant environmentally restricted substances outlined in the Joint Industry Guide - Materials Composition Declaration for Electrotechnical Products (JIG-101) as well as other substances of concern due to their potential negative social and environmental impacts.

LSI has and continues to develop environmentally responsible products which are lead (Pb)-free and halogen (bromine (Br) and chlorine (Cl))-free. In fact, LSI has “Green” IC Products which are lead-free, halogen free and antimony (Sb)-free. The diagrams below depict the location of where lead, antimony, and halogens Br, Cl may be found in traditional IC products. In many cases, matte tin plating replaced Sn/Pb plating, and tin silver copper (SnAgCu or SAC Alloy) solder balls/bumps replaced SnPb solder balls/bumps. Furthermore, metal hydroxide flame retardant systems replaced antimony trioxide/brominated flame retardant systems in mold compounds and substrates. LSI is also proud of the fact that we have “green” Flip Chip IC products available even though a Flip Chip exemption still exists under the EU RoHS Directive allows for continued use of leaded solder bumps.