Compliance, Definitions and Marking

What does “RoHS” mean?
Answer: RoHS is an acronym for Restriction of the use of certain Hazardous Substances in Electrical and Electronic Equipment (EEE), an European Union Directive (EU RoHS Directive 2002/95/EC) which became enforceable on 01 July 2006 and was subsequently recast by Directive 2011/65/EU. This EU Directive set maximum concentration limits on lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE) used in EEE.

Are LSI products “RoHS-5/6” or “RoHS-6/6”?
Answer: All LSI IC and board products are “RoHS-5/6” Compliant and do not contain cadmium, hexavalent chromium, mercury, polybrominated biphenyls (PBB), or polybrominated diphenyl ethers (PBDE) above EU RoHS Directive limits. Only lead-free IC products are considered “RoHS-6/6” Compliant.

What is LSI’s definition of “lead-free”?
Answer: Similar to the EU RoHS Directive, LSI defines the term "lead-free" to mean that lead is “not intentionally added” or “is present” at a maximum 0.1% (1,000 ppm) as an incidental impurity in homogeneous materials.

Are LSI lead-free products RoHS Compliant?
Answer: Yes. All versions of LSI lead-free IC products are RoHS compliant. In the case of leadframes and ball grid arrays (BGAs), these lead-free products are manufactured without lead in the interconnects unless authorized by an exemption in the Annex to the EU RoHS Directive. Additionally, all LSI IC products (both lead-containing and lead-free) do not contain cadmium, hexavalent chromium, mercury, polybrominated biphenyls (PBB), or polybrominated diphenyl ethers (PBDE). LSI's Flip-Chip BGA packages currently qualify for an exemption from under the EU RoHS Directive. Under this exemption, first level interconnect solder bumps between the semiconductor die and carrier within flip-chip package types can continue to contain lead and still be considered RoHS compliant. The second level interconnects on the exterior of the package are lead-free. LSI does offer a completely lead-free Flip-Chip package option. LSI also offers board products which are RoHS compliant. Some board products are also halogen-free in addition to being RoHS Compliant.

What is LSI’s definition of “Green”?
Answer: The definition of "Green" is not currently defined by any international regulation or industry standard organizations; therefore "green" is generally company or user defined. LSI defines "Green” IC Products as those that are RoHS Compliant/Lead-free, Halogen-free and Antimony-free. More specifically, LSI’s “Green” IC Products are:

  • RoHS Compliant/Lead-free – i.e., Quantity limit of 0.1 % by mass (1000 PPM) in homogeneous material for: lead, mercury, hexavalent chromium, polybrominated biphenyls (PBB), polybrominated diphenyl ethers (PBDE) and quantity limit of 0.01 % by mass (100 PPM) of homogeneous material for Cadmium
  • Halogen-free – i.e., Quantity limit of 0.09 % by mass (900 PPM) in homogeneous material for Bromine and Chlorine and less than 0.15% (1500 PPM) total Bromine and Chlorine in homogeneous materials
  • Antimony-free – i.e., Quantity limit of 0.09 % by mass (900 PPM) in homogeneous material for Antimony.

What's the difference between "Green" and "RoHS Compliant" products?
Answer: LSI’s “Green” IC Products are Halogen-free and Antimony-free in addition to being RoHS Compliant and Lead-free. LSI continues to closely monitor governmental bodies and industry standardization groups on “green” definitions to ensure product compliance.

What is LSI’s lead-free marking standard for components and shipping containers?
Answer: LSI has adopted the IPC/JEDEC Marking and Labeling of Components (J-STD-609A) for marking its packages as follows:
e1 = SnAgCu (i.e. solder balls)
e2 = Tin alloys (i.e. SnCu, SnAg) with
no bismuth (Bi) or zinc (ZN)
e3 = Sn (i.e. matte Sn)
e4 = Pre-plated (i.e. NiPdAu, NiPd)
e6 = Contains bismuth (Bi)

How do you distinguish between LSI's lead-free products and tin/lead products?
Answer: Customers can distinguish between a lead-free IC product and a tin/lead product by either the part number designation (e.g., an “L-“ prefix added to the existing tin/lead product code) or the lead free markings on the package themselves. In general, all lead-free products are assigned a new part number. Effective November 2007, LSI began using a new package naming convention to help our customers identify lead free product. Package name suffixes may contain the following letters to designate lead free products:
1. Lead Frame: L = lead free; G = “Green” and lead free.
2. BGA: L = Lead free; G = “Green” and lead free; K = lead free, halogen free, but not antimony free.
3. Flip Chip: G = “Green” and lead free balls and bumps; LM = lead free balls and bumps; K or L = lead free balls only.

IC product labels contain an Environmental Compliance Status. There are four distinct Environmental Compliance Statuses for the EU RoHS Directive and they are:
1. RoHS Compliant and Pb-Free - All six (6) EU RoHS Directive restricted substances absent or below threshold limits.
2. RoHS Compliant and Green- All six (6) EU RoHS Directive restricted substances absent or below threshold limits and meets all the requirements for LSI Green IC Product.
3. RoHS Compliant exc. Pb in 2LI – Product contains lead (Pb) in 2nd level interconnect, solder ball or plated leads per an EU RoHS Directive Exemption.
4. RoHS Compliant w/FC exemption - Product contains lead (Pb) in solder between die (bumped) and substrate - internal to Flip Chip package interconnect per the EU RoHS Directive Exemption; however the external (2nd level interconnect) solder balls are lead-free.

Where can I find the LSI Certificates of Compliance for RoHS / WEEE?
Answer: Visit our Declarations and Certifications section.

Can I get a Material Declaration, IPC-1752 report or additional product environmental information?
Answer: Yes. Please contact your local LSI Sales Representative for a Material Declaration, IPC-1752 report or other product environmental information such as analytical reports.

Will LSI continue to offer tin-lead solutions?
Answer: Yes. LSI understands that customers will have an ongoing need for tin/lead solutions and is committed to supporting customer tin/lead product needs throughout their transition to lead-free products. LSI recognizes the industry-wide issues of migrating to lead-free products, including compatibility of the tin/silver/copper (SAC) alloy with tin/lead paste, RoHS exemptions, and spare parts. LSI will work with customers having specific requirements for lead-containing products.

Processing

Do lead-free IC packages meet 260oC temperature rating?
Answer: : LSI packages meet J-STD-020C or J-STD-20D requirements according to package size, volume and date of qualification. (In the March 2008 timeframe, LSI implemented reflow profiles following JEDEC J-STD-020D for new package and product qualifications.) J-STD-020C and J-STD-020D are joint standards established between IPC (Association Connecting Electronics Industries) and JEDEC which identifies the classification level of non-hermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress. Customer specific requirements will be reviewed on case by case basis.

Are LSI lead-free IC packages compliant to the JEDEC industry standard?
Answer: Yes. All LSI lead-free IC packages are compliant with J-STD-020C or J-STD-20D requirements for moisture sensitivity / reflow classification.

Can standard tin-lead components be assembled under lead-free reflow conditions?
Answer: LSI recommends reflowing components with the appropriate reflow temperature guidelines defined by J-STD-020C or J-STD-02D. It is not recommended to mix lead-free packages with standard tin-lead assembly conditions (backward compatibility) or vice versa.