Compliance, Definitions and Marking
What does “RoHS” mean?
Answer: RoHS is an acronym for Restriction of the use of certain Hazardous Substances
in Electrical and Electronic Equipment (EEE), a European Union Directive (EU RoHS
Directive 2002/95/EC) which became enforceable on 01 July 2006. This EU Directive
set maximum concentration limits on lead, mercury, cadmium, hexavalent chromium,
polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE) used in
Are LSI products “RoHS-5/6” or “RoHS-6/6”?
Answer: All LSI IC products are “RoHS-5/6” Compliant and do not contain cadmium,
hexavalent chromium, mercury, polybrominated biphenyls (PBB) or polybrominated diphenyl
ethers (PBDE) above EU RoHS Directive limits. Only lead-free IC products are considered
What is LSI’s definition of “lead-free”?
Answer: Similar to
the EU RoHS Directive, LSI defines the term "lead-free" to mean that lead
is “not intentionally added” or “is present” at a maximum 0.1% (1,000 ppm) as an
incidental impurity in homogeneous materials.
Are LSI lead-free products RoHS Compliant?
Answer: Yes. All versions of LSI lead-free IC products are RoHS Compliant. In the
case of leadframes and ball grid arrays (BGAs), these lead-free products are manufactured
without lead in the interconnects unless authorized by an exemption in the Annex
to the EU RoHS Directive. Additionally, all LSI IC products (both lead-containing
and lead-free) do not contain cadmium, hexavalent chromium, mercury, polybrominated
biphenyls (PBB) or polybrominated diphenyl ethers (PBDE). LSI's Flip-Chip BGA
packages currently qualify for an exemption from under the EU RoHS Directive. Under
this exemption, first level interconnect solder bumps between the semiconductor
die and carrier within flip-chip package types can continue to contain lead and
still be considered RoHS Compliant. The second level solder bumps on the exterior
of the package are lead-free. LSI does offer a completely lead-free Flip-Chip package
option. LSI also offers storage PCBA products which are RoHS Compliant. Some storage
PCBA products are also halogen-free in addition to being RoHS Compliant.
What is LSI’s definition of “Green”?
Answer: The definition of "Green" is not currently defined
by any international regulation or industry standard organizations; therefore, "green"
is generally company or user defined. LSI defines "Green” IC Products as those
that are RoHS Compliant/Lead-free, Halogen-free and Antimony-free. More specifically,
LSI’s “Green” IC Products are:
- RoHS Compliant/Lead-free – i.e., Quantity limit of 0.1% by mass (1000 PPM) in homogeneous
material for: lead, mercury, hexavalent chromium, polybrominated biphenyls (PBB),
polybrominated diphenyl ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM)
of homogeneous material for Cadmium
- Halogen-free – i.e., Quantity limit of 0.09% by mass (900 PPM) in homogeneous material
for Bromine and Chlorine and less than 0.15% (1500 PPM) total Bromine and Chlorine
in homogeneous materials
- Antimony-free – i.e., Quantity limit of 0.09% by mass (900 PPM) in homogeneous material
What's the difference between "Green" and "RoHS Compliant"
Answer: LSI’s “Green” IC Products are Halogen-free and Antimony-free in addition
to being RoHS Compliant and Lead-free. LSI continues to closely monitor governmental
bodies and industry standardization groups on “green” definitions to ensure product
What is LSI’s lead-free marking standard for components and shipping containers?
Answer: LSI has adopted the IPC/JEDEC Marking and Labeling of Components (J-STD-609A)
for marking its packages as follows:
e0 = Lead
e1 = SnAgCu (i.e. solder balls)
e2 = Tin alloys (i.e. SnCu, SnAg) with
no bismuth (Bi) or zinc (ZN)
e3 = Sn (i.e. matte Sn)
e4 = Pre-plated (i.e. NiPdAu, NiPd)
e6 = Contains bismuth (Bi)
How do you distinguish between LSI's lead-free products and tin/lead products?
Answer: Customers can distinguish between a lead-free IC product and a tin/lead
product by either the part number designation (e.g., an “L-“ prefix added to the
existing tin/lead product code) or the lead-free markings on the packages themselves.
In general, all lead-free products are assigned a new part number. Effective November
2007, LSI began using a new package naming convention to help our customers identify
lead-free product. Package name suffixes may contain the following letters to designate
1. Lead Frame: L = lead free; G = “Green” and lead free.
2. BGA: L = Lead free; G = “Green” and lead free; K = lead free, halogen free, but
not antimony free.
3. Flip Chip: G = “Green” and lead free balls and bumps; LM = lead free balls and
bumps; K or L = lead free balls only.
IC product labels contain an Environmental Compliance Status. There are four distinct
Environmental Compliance Statuses for the EU RoHS Directive and they are:
1. RoHS Compliant and Pb-Free - All six (6) EU RoHS Directive restricted substances
absent or below threshold limits.
2. RoHS Compliant and Green - All six (6) EU RoHS Directive restricted substances
absent or below threshold limits and meets all the requirements for LSI Green IC
3. RoHS Compliant exc. Pb in 2LI – Product contains lead (Pb) in 2nd level interconnect,
solder ball or plated leads per an EU RoHS Directive Exemption.
4. RoHS Compliant w/FC exemption - Product contains lead (Pb) in solder between
die (bumped) and substrate - internal to Flip-Chip package interconnect per the
EU RoHS Directive Exemption; however, the external (2nd level interconnect) solder
balls are lead free.
Where can I find the LSI Certificates of Compliance for RoHS / WEEE?
Answer: Visit our
Declarations and Certifications section.
Can I get a Material Declaration, IPC-1752 report or additional product environmental
Answer: Yes. Please contact
your local LSI Sales Representative for a Material Declaration, IPC-1752 report
or other product environmental information such as analytical reports.
Will LSI continue to offer tin-lead solutions?
Answer: Yes. LSI understands that customers will have an ongoing need for tin/lead
solutions and is committed to supporting customer tin/lead product needs throughout
their transition to lead-free products. LSI recognizes the industry-wide issues
of migrating to lead-free products, including compatibility of the tin/silver/copper
(SAC) alloy with tin/lead paste, RoHS exemptions and spare parts. LSI will work
with customers having specific requirements for lead-containing products.
Do lead-free IC packages meet 260oC temperature rating?
Answer: LSI packages meet J-STD-020C or J-STD-20D requirements according to package
size, volume and date of qualification. (In the March 2008 timeframe, LSI implemented
reflow profiles following JEDEC J-STD-020D for new package and product qualifications.)
J-STD-020C and J-STD-020D are joint standards established between
IPC (Association Connecting Electronics Industries) and
JEDEC which identifies the classification level of non-hermetic solid-state
surface mount devices (SMDs) that are sensitive to moisture-induced stress. Customer
specific requirements will be reviewed on a case by case basis.
Are LSI lead-free IC packages compliant to the JEDEC industry standard?
Answer: Yes. All LSI lead-free IC packages are compliant with J-STD-020C or J-STD-020D
requirements for moisture sensitivity / reflow classification.
Can standard tin-lead components be assembled under lead-free reflow conditions?
Answer: LSI recommends reflowing components with the appropriate reflow temperature
guidelines defined by J-STD-020C or J-STD-020D. It is not recommended to mix lead-free
packages with standard tin-lead assembly conditions (backward compatibility) or